The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: GLASS ENCLOSURE, overall_length: 0.170 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 1.000 INCHES MINIMUM IN, overall_diameter: 0.016 INCHES MINIMUM IN, features_provided: HERMETICALLY SEALED CASE. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-252-1309, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| material | GLASS ENCLOSURE |
| overall_length | 0.170 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 1.000 INCHES MINIMUM IN |
| overall_diameter | 0.016 INCHES MINIMUM IN |
| features_provided | HERMETICALLY SEALED CASE |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| power_rating_per_characteristic | 250.0 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION |
| current_rating_per_characteristic | 10.00 MICROAMPERES MAXIMUM FORWARD CURRENT, DC |
| voltage_rating_in_volts_per_characteristic | -70.0 MAXIMUM BREAKDOWN VOLTAGE, DC |
| maximum_operating_temp_per_measurement_point | 200.0 CELSIUS AMBIENT AIR DEGC |
| NSN | 5961-00-252-1309 |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 CELSIUS AMBIENT AIR DEGC |
| MATERIAL | SILICON SEMICONDUCTOR |
| POWER RATING PER CHARACTERISTIC | 250.0 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION |
| OVERALL DIAMETER | 0.016 INCHES MINIMUM IN |
| CURRENT RATING PER CHARACTERISTIC | 10.00 MICROAMPERES MAXIMUM FORWARD CURRENT, DC |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| TERMINAL LENGTH | 1.000 INCHES MINIMUM IN |
| MOUNTING METHOD | TERMINAL |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | -70.0 MAXIMUM BREAKDOWN VOLTAGE, DC |
| OVERALL LENGTH | 0.170 INCHES MAXIMUM IN |