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591897-1 — SEMICONDUCTOR DEVICE ASSEMBLY

✓ Government record, cited
— · SFP TRANSCEIVER
PRODUCT OVERVIEW

591897-1: SEMICONDUCTOR DEVICE ASSEMBLY.

The SEMICONDUCTOR DEVICE ASSEMBLY is a the manufacturer industrial component. Key specifications include overall_width: 0.385 INCHES MINIMUM AND 0.395 INCHES MAXIMUM IN, overall_height: 0.842 INCHES MINIMUM AND 0.847 INCHES MAXIMUM IN, overall_length: 0.845 INCHES MINIMUM AND 0.855 INCHES MAXIMUM IN, major_components: DIODE 2,PIN CONTACT 4,SEALING PLUG 2,RETAINING CLIP 1,MODULE HOUSING 1,CONTACT SOCKET 1, end_item_identification: JOINT STARS AIRFRAME, part_name_assigned_by_controlling_agency: MODULE FEED-BACK ASSEMBLY,SIZE 20TJ WITH TWO JANTX1N5618 DIODES. This part is cataloged in the U.S.

Government catalog under NSN 5961-01-511-0060, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
591897-1
NSN: 5961-01-511-0060
FSC: 5961 — Semiconductor Devices and Associated Hardware
CAGE: 00779 — TE CONNECTIVITY CORPORATION (USA)
SPECIFICATIONS
overall_width0.385 INCHES MINIMUM AND 0.395 INCHES MAXIMUM IN
overall_height0.842 INCHES MINIMUM AND 0.847 INCHES MAXIMUM IN
overall_length0.845 INCHES MINIMUM AND 0.855 INCHES MAXIMUM IN
major_componentsDIODE 2,PIN CONTACT 4,SEALING PLUG 2,RETAINING CLIP 1,MODULE HOUSING 1,CONTACT SOCKET 1
end_item_identificationJOINT STARS AIRFRAME
part_name_assigned_by_controlling_agencyMODULE FEED-BACK ASSEMBLY,SIZE 20TJ WITH TWO JANTX1N5618 DIODES
NSN5961-01-511-0060
COMPONENT DIAGRAM
BAIL LATCH 10G SFP+ 850nm · SR (MMF, 300m) DOM: Digital Optical Monitoring TX RX LC DUPLEX 20-PIN EDGE CONNECTOR ~56.5 mm ~13.4mm SFP+ TRANSCEIVER | 10G | 850nm | SR (MMF, 300m) Hot-swappable | LC duplex fiber | DDM/DOM supported TITLE SFP+ XCVR PN 591897-1 MFR OEM SEMICONDUCTOR DEVICE ASSEMBLY
KEY FEATURES
•
MAJOR COMPONENTS: DIODE 2,PIN CONTACT 4,SEALING PLUG 2,RETAINING CLIP 1,MODULE HOUSING 1,CONTACT SOCKET 1
TECHNICAL CHARACTERISTICS
OVERALL HEIGHT0.842 INCHES MINIMUM AND 0.847 INCHES MAXIMUM IN
MAJOR COMPONENTSDIODE 2,PIN CONTACT 4,SEALING PLUG 2,RETAINING CLIP 1,MODULE HOUSING 1,CONTACT SOCKET 1
OVERALL LENGTH0.845 INCHES MINIMUM AND 0.855 INCHES MAXIMUM IN
OVERALL WIDTH0.385 INCHES MINIMUM AND 0.395 INCHES MAXIMUM IN
PART NAME ASSIGNED BY CONTROLLING AGENCYMODULE FEED-BACK ASSEMBLY,SIZE 20TJ WITH TWO JANTX1N5618 DIODES
END ITEM IDENTIFICATIONJOINT STARS AIRFRAME
OTHER ITEMS IN FSC 5961 — Semiconductor Devices and Associated Hardware
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5961-00-000-0150 5961-00-000-4541 5961-00-000-5400 5961-00-000-7614 5961-00-000-8760 5961-00-001-1352 5961-00-001-2624 5961-00-001-2978
SUBSTITUTES & CROSS-REFERENCES 2
591897-2Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
GM812D5Reference document
Same NSN cross-reference
Reference document — Vendor item drawing reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedNo demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is 591897-1?
591897-1 is a SEMICONDUCTOR DEVICE ASSEMBLY.
What parts can replace 591897-1?
There are 2 known substitutes for 591897-1: 591897-2, GM812D5. Substitute compatibility should be verified for your specific system.
What is the NSN for 591897-1?
591897-1 is cataloged in the U.S. Government catalog under NSN 5961-01-511-0060. This indicates validated use in U.S. government and defense supply chains.
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