GM812D5: SEMICONDUCTOR DEVICE ASSEMBLY.
The SEMICONDUCTOR DEVICE ASSEMBLY is a the manufacturer industrial component. Key specifications include overall_width: 0.385 INCHES MINIMUM AND 0.395 INCHES MAXIMUM IN, overall_height: 0.842 INCHES MINIMUM AND 0.847 INCHES MAXIMUM IN, overall_length: 0.845 INCHES MINIMUM AND 0.855 INCHES MAXIMUM IN, major_components: DIODE 2,PIN CONTACT 4,SEALING PLUG 2,RETAINING CLIP 1,MODULE HOUSING 1,CONTACT SOCKET 1, end_item_identification: JOINT STARS AIRFRAME, part_name_assigned_by_controlling_agency: MODULE FEED-BACK ASSEMBLY,SIZE 20TJ WITH TWO JANTX1N5618 DIODES. This part is cataloged in the U.S.
Government catalog under NSN 5961-01-511-0060, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| overall_width | 0.385 INCHES MINIMUM AND 0.395 INCHES MAXIMUM IN |
| overall_height | 0.842 INCHES MINIMUM AND 0.847 INCHES MAXIMUM IN |
| overall_length | 0.845 INCHES MINIMUM AND 0.855 INCHES MAXIMUM IN |
| major_components | DIODE 2,PIN CONTACT 4,SEALING PLUG 2,RETAINING CLIP 1,MODULE HOUSING 1,CONTACT SOCKET 1 |
| end_item_identification | JOINT STARS AIRFRAME |
| part_name_assigned_by_controlling_agency | MODULE FEED-BACK ASSEMBLY,SIZE 20TJ WITH TWO JANTX1N5618 DIODES |
| NSN | 5961-01-511-0060 |
| OVERALL HEIGHT | 0.842 INCHES MINIMUM AND 0.847 INCHES MAXIMUM IN |
| MAJOR COMPONENTS | DIODE 2,PIN CONTACT 4,SEALING PLUG 2,RETAINING CLIP 1,MODULE HOUSING 1,CONTACT SOCKET 1 |
| OVERALL LENGTH | 0.845 INCHES MINIMUM AND 0.855 INCHES MAXIMUM IN |
| OVERALL WIDTH | 0.385 INCHES MINIMUM AND 0.395 INCHES MAXIMUM IN |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | MODULE FEED-BACK ASSEMBLY,SIZE 20TJ WITH TWO JANTX1N5618 DIODES |
| END ITEM IDENTIFICATION | JOINT STARS AIRFRAME |