The SEMICONDUCTOR DEVICES,UNITIZED is a the manufacturer industrial component. Key specifications include material: PLASTIC ENCLOSURE, overall_width: 0.300 INCHES NOMINAL IN, overall_height: 0.200 INCHES MAXIMUM IN, overall_length: 0.785 INCHES MAXIMUM IN, mounting_method: PRESS FIT, special_features: ALL TRANSISTOR JUNCTION PATTERN ARRANGEMENT: NPN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-01-053-9451, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | PLASTIC ENCLOSURE |
| overall_width | 0.300 INCHES NOMINAL IN |
| overall_height | 0.200 INCHES MAXIMUM IN |
| overall_length | 0.785 INCHES MAXIMUM IN |
| mounting_method | PRESS FIT |
| special_features | ALL TRANSISTOR JUNCTION PATTERN ARRANGEMENT: NPN |
| features_provided | HERMETICALLY SEALED CASE |
| semiconductor_material | SILICON ALL TRANSISTOR |
| terminal_type_and_quantity | 14 RIBBON |
| component_name_and_quantity | 4 TRANSISTOR |
| power_rating_per_characteristic | 1300.0 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION ALL TRANSISTOR |
| current_rating_per_characteristic | 500.00 MILLIAMPERES MAXIMUM COLLECTOR CURRENT, DC ALL TRANSISTOR |
| NSN | 5961-01-053-9451 |
| MOUNTING METHOD | PRESS FIT |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| OVERALL HEIGHT | 0.200 INCHES MAXIMUM IN |
| OVERALL LENGTH | 0.785 INCHES MAXIMUM IN |
| COMPONENT NAME AND QUANTITY | 4 TRANSISTOR |
| OVERALL WIDTH | 0.300 INCHES NOMINAL IN |
| TERMINAL TYPE AND QUANTITY | 14 RIBBON |
| CURRENT RATING PER CHARACTERISTIC | 500.00 MILLIAMPERES MAXIMUM COLLECTOR CURRENT, DC ALL TRANSISTOR |
| SPECIAL FEATURES | ALL TRANSISTOR JUNCTION PATTERN ARRANGEMENT: NPN |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 CELSIUS JUNCTION DEGC |