53091-2 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

53091-2: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.610 INCHES MAXIMUM IN, body_height: 0.217 INCHES MAXIMUM IN, body_length: 1.490 INCHES MAXIMUM IN, special_features: B96906-MIL-STD-883, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMED AND ELECTROSTATIC SENSITIVE AND W/SHORT CIRCUIT PROTECTION, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-381-7826, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

53091-2

NSN: 5962-01-381-7826
FSC: 5962 — Microcircuits, Electronic
CAGE: 05869 — RAYTHEON COMPANY DIV RMD STRATEGIC (USA)

SPECIFICATIONS

body_width	0.610 INCHES MAXIMUM IN
body_height	0.217 INCHES MAXIMUM IN
body_length	1.490 INCHES MAXIMUM IN
special_features	B96906-MIL-STD-883
features_provided	HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMED AND ELECTROSTATIC SENSITIVE AND W/SHORT CIRCUIT PROTECTION
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	EPROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	17 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-381-7826

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 17 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.610 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.217 INCHES MAXIMUM IN

•

CAPITANCE RATING PER CHARACTERISTIC: 6.00 INPUT PICOFARADS MINIMUM AND 12.00 OUTPUT PICOFARADS MAXIMUM

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMED AND ELECTROSTATIC SENSITIVE AND W/SHORT CIRCUIT PROTECTION

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	17 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.610 INCHES MAXIMUM IN
BODY HEIGHT	0.217 INCHES MAXIMUM IN
CAPITANCE RATING PER CHARACTERISTIC	6.00 INPUT PICOFARADS MINIMUM AND 12.00 OUTPUT PICOFARADS MAXIMUM
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMED AND ELECTROSTATIC SENSITIVE AND W/SHORT CIRCUIT PROTECTION
INCLOSURE CONFIGURATION	DUAL-IN-LINE
CURRENT RATING PER CHARACTERISTIC	150.00 MILLIAMPERES MAXIMUM SUPPLY
MEMORY DEVICE TYPE	EPROM

SUBSTITUTES & CROSS-REFERENCES 2

8202502YAReference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROM FAMILY 191Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 53091-2?

53091-2 is a MICROCIRCUIT,MEMORY.

What parts can replace 53091-2?

There are 2 known substitutes for 53091-2: 8202502YA, ROM/PROM FAMILY 191. Substitute compatibility should be verified for your specific system.

What is the NSN for 53091-2?

53091-2 is cataloged in the U.S. Government catalog under NSN 5962-01-381-7826. This indicates validated use in U.S. government and defense supply chains.

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53091-2 — MICROCIRCUIT,MEMORY

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