ROM/PROM FAMILY 191: NETWORK ASSEMBLY,DIODE,POSITIVE.
NETWORK ASSEMBLY,DIODE,POSITIVE. Key specifications include body_width: 0.610 INCHES MAXIMUM IN, body_height: 0.217 INCHES MAXIMUM IN, body_length: 1.490 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, special_features: B96906-MIL-STD-883, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND ULTRAVIOLET ERASABLE AND PROGRAMMED AND ELECTROSTATIC SENSITIVE. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-303-8078, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.610 INCHES MAXIMUM IN |
| body_height | 0.217 INCHES MAXIMUM IN |
| body_length | 1.490 INCHES MAXIMUM IN |
| memory_capacity | UNKNOWN |
| special_features | B96906-MIL-STD-883 |
| features_provided | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND ULTRAVIOLET ERASABLE AND PROGRAMMED AND ELECTROSTATIC SENSITIVE |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | EPROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| NSN | 5962-01-303-8078 |
| INPUT CIRCUIT PATTERN | 11 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.610 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.217 INCHES MAXIMUM IN |
| FEATURES PROVIDED | MONOLITHIC AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| MEMORY DEVICE TYPE | ROM |
| CASE OUTLINE SOURCE AND DESIGNATOR | D-10 MIL-M-38510 |
| BODY LENGTH | 1.490 INCHES MAXIMUM IN |