5034-101: SEMICONDUCTOR DEVICE,THYRISTOR.
The SEMICONDUCTOR DEVICE,THYRISTOR is a the manufacturer industrial component. Key specifications include material: CERAMIC ENCLOSURE, body_width: 1.000 INCHES MAXIMUM IN, body_height: 0.810 INCHES MAXIMUM IN, body_length: 1.000 INCHES MAXIMUM IN, rating_method: ELECTRICAL SINGLE COMPONENT SINGLE WINDING, inclosure_type: FULLY INCLOSED. This part is cataloged in the U.S.
Government catalog under NSN 5961-01-060-6663, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | CERAMIC ENCLOSURE |
| body_width | 1.000 INCHES MAXIMUM IN |
| body_height | 0.810 INCHES MAXIMUM IN |
| body_length | 1.000 INCHES MAXIMUM IN |
| rating_method | ELECTRICAL SINGLE COMPONENT SINGLE WINDING |
| inclosure_type | FULLY INCLOSED |
| overall_length | 0.520 INCHES NOMINAL IN |
| inductance_type | SWINGING |
| mounting_method | TERMINAL SINGLE GROUP |
| frequency_rating | 60.0 KILOHERTZ NOMINAL SINGLE COMPONENT |
| special_features | NSN RESTRICTED TO USE BY NWS DEPOT TEAM ONLY |
| winding_quantity | 1 SINGLE COMPONENT |
| NSN | 5961-01-060-6663 |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 1300.0 NOMINAL ON-STATE VOLTAGE, DC |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 125.0 CELSIUS JUNCTION DEGC |
| MOUNTING METHOD | PRESS FIT |
| SEMICONDUCTOR MATERIAL | SILICON |
| OVERALL LENGTH | 0.520 INCHES NOMINAL IN |
| CURRENT RATING PER CHARACTERISTIC | 100.00 MILLIAMPERES NOMINAL HOLDING CURRENT, DC |
| SPECIAL FEATURES | NSN RESTRICTED TO USE BY NWS DEPOT TEAM ONLY |
| END ITEM IDENTIFICATION | AIRPORT SURVEILLANCE RADAR (ASR-9); NEXT GENERATION RADAR (NEXRAD) |
| MATERIAL | CERAMIC ENCLOSURE |
| TERMINAL TYPE AND QUANTITY | 2 CASE |