Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: 50-800150-1

50-800150-1 ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.265 INCHES MINIMUM AND 0.291 INCHES MAXIMUM IN, body_height: 0.150 INCHES MINIMUM AND 0.199 INCHES MAXIMUM IN, body_length: 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND PROGRAMMABLE AND HIGH SPEED AND W/DISABLE AND WIRE-OR OUTPUTS, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-062-4600, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

50-800150-1

NSN: 5962-01-062-4600
FSC: 5962
CAGE: 53613 — GOULD INC DEFENSE SYSTEMS NAVCOM SYSTEMS DIV 3DBM OPNS (USA)

SPECIFICATIONS

body_width	0.265 INCHES MINIMUM AND 0.291 INCHES MAXIMUM IN
body_height	0.150 INCHES MINIMUM AND 0.199 INCHES MAXIMUM IN
body_length	0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND PROGRAMMABLE AND HIGH SPEED AND W/DISABLE AND WIRE-OR OUTPUTS
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-062-4600

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

TIME RATING PER CHACTERISTIC: 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS

•

TERMINAL SURFACE TREATMENT: SOLDER

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MEMORY DEVICE TYPE: ROM

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TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT

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VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE

•

FEATURES PROVIDED: HERMETICALLY SEALED AND PROGRAMMABLE AND HIGH SPEED AND W/DISABLE AND WIRE-OR OUTPUTS

•

OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

INCLOSURE CONFIGURATION	DUAL-IN-LINE
TIME RATING PER CHACTERISTIC	60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
TERMINAL SURFACE TREATMENT	SOLDER
MEMORY DEVICE TYPE	ROM
TERMINAL TYPE AND QUANTITY	16 PRINTED CIRCUIT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	-1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE
FEATURES PROVIDED	HERMETICALLY SEALED AND PROGRAMMABLE AND HIGH SPEED AND W/DISABLE AND WIRE-OR OUTPUTS
OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
INPUT CIRCUIT PATTERN	10 INPUT

VERIFIED SUBSTITUTES & CROSS-REFERENCES 7

98-800128Interchangeable