F93417DM: RESISTOR SUBASSEMBLY.
The RESISTOR SUBASSEMBLY is a the manufacturer industrial component. Key specifications include body_width: 0.265 INCHES MINIMUM AND 0.291 INCHES MAXIMUM IN, body_height: 0.199 INCHES MAXIMUM IN, body_length: 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN, overall_height: 0.235 INCHES MINIMUM IN, memory_capacity: UNKNOWN, features_provided: SCHOTTKY AND HIGH SPEED AND PROGRAMMABLE AND WIRE-OR OUTPUTS. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-062-4349, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.265 INCHES MINIMUM AND 0.291 INCHES MAXIMUM IN |
| body_height | 0.199 INCHES MAXIMUM IN |
| body_length | 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |
| overall_height | 0.235 INCHES MINIMUM IN |
| memory_capacity | UNKNOWN |
| features_provided | SCHOTTKY AND HIGH SPEED AND PROGRAMMABLE AND WIRE-OR OUTPUTS |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| precious_material | GOLD |
| inclosure_material | CERAMIC |
| memory_device_type | ROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| NSN | 5962-01-062-4349 |
| INPUT CIRCUIT PATTERN | 10 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.265 INCHES MINIMUM AND 0.291 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.199 INCHES NOMINAL IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND PROGRAMMABLE AND SCHOTTKY AND HIGH SPEED |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| MEMORY DEVICE TYPE | ROM |
| BODY LENGTH | 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |