Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: 4014490-26

4014490-26 ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.294 INCHES MAXIMUM IN, body_height: 0.204 INCHES MAXIMUM IN, body_length: 0.808 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND BIPOLAR AND PROGRAMMABLE AND W/ENABLE AND 3-STATE OUTPUT, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-079-4980, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

4014490-26

NSN: 5962-01-079-4980
FSC: 5962
CAGE: 1PQF4 — CAE USA INC. (USA)

SPECIFICATIONS

body_width	0.294 INCHES MAXIMUM IN
body_height	0.204 INCHES MAXIMUM IN
body_length	0.808 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND BIPOLAR AND PROGRAMMABLE AND W/ENABLE AND 3-STATE OUTPUT
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 75.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-079-4980

COMPONENT DIAGRAM

KEY FEATURES

•

MAXIMUM POWER DISSIPATION RATING: 2.5 WATTS

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

TIME RATING PER CHACTERISTIC: 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS

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TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT

•

MEMORY DEVICE TYPE: ROM

•

MEMORY CAPACITY: UNKNOWN

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VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

MAXIMUM POWER DISSIPATION RATING	2.5 WATTS
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
TIME RATING PER CHACTERISTIC	70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
TERMINAL TYPE AND QUANTITY	16 PRINTED CIRCUIT
MEMORY DEVICE TYPE	ROM
MEMORY CAPACITY	UNKNOWN
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	7.0 VOLTS MAXIMUM POWER SOURCE
OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC
INCLOSURE CONFIGURATION	DUAL-IN-LINE

VERIFIED SUBSTITUTES & CROSS-REFERENCES 20

IM5624Interchangeable