MM6306J: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.265 INCHES MINIMUM AND 0.291 INCHES MAXIMUM IN, body_height: 0.199 INCHES MAXIMUM IN, body_length: 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN, bit_quantity: 2048, word_quantity: 512, memory_capacity: UNKNOWN. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-079-4980, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.265 INCHES MINIMUM AND 0.291 INCHES MAXIMUM IN |
| body_height | 0.199 INCHES MAXIMUM IN |
| body_length | 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |
| bit_quantity | 2048 |
| word_quantity | 512 |
| memory_capacity | UNKNOWN |
| features_provided | HERMETICALLY SEALED AND PROGRAMMABLE AND W/ENABLE AND 3-STATE OUTPUT |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | ROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| NSN | 5962-01-079-4980 |
| INPUT CIRCUIT PATTERN | 10 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.294 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.204 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BIPOLAR AND PROGRAMMABLE AND W/ENABLE AND 3-STATE OUTPUT |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| MEMORY DEVICE TYPE | ROM |
| BODY LENGTH | 0.808 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |