The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 1.650 INCHES MINIMUM IN, mounting_method: THREADED STUD(S), overall_diameter: 0.635 INCHES NOMINAL IN, features_provided: HERMETICALLY SEALED CASE, nominal_thread_size: 0.250 INCHES IN. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-971-6323, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_length | 1.650 INCHES MINIMUM IN |
| mounting_method | THREADED STUD(S) |
| overall_diameter | 0.635 INCHES NOMINAL IN |
| features_provided | HERMETICALLY SEALED CASE |
| nominal_thread_size | 0.250 INCHES IN |
| thread_series_designator | UNF |
| mounting_facility_quantity | 1 |
| terminal_type_and_quantity | 1 TAB, SOLDER LUG AND 1 THREADED STUD |
| specification/standard_data | 80131-RELEASE3291 PROFESSIONAL/INDUSTRIAL ASSOCIATION SPECIFICATION |
| current_rating_per_characteristic | 15.00 AMPERES MAXIMUM AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE |
| voltage_rating_in_volts_per_characteristic | 200.0 MAXIMUM REVERSE VOLTAGE, PEAK |
| NSN | 5961-00-971-6323 |
| NOMINAL THREAD SIZE | 0.250 INCHES IN |
| MOUNTING FACILITY QUANTITY | 1 |
| TERMINAL TYPE AND QUANTITY | 1 TAB, SOLDER LUG AND 1 THREADED STUD |
| THREAD SERIES DESIGNATOR | UNF |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 175.0 CELSIUS CASE DEGC |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| MOUNTING METHOD | THREADED STUD(S) |
| MATERIAL | SILICON SEMICONDUCTOR |
| OVERALL LENGTH | 1.650 INCHES MINIMUM IN |
| OVERALL DIAMETER | 0.635 INCHES NOMINAL IN |