The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include width: 0.440 INCHES NOMINAL IN, length: 1.499 INCHES NOMINAL IN, material: COPPER ALLOY OVERALL, overall_height: 0.180 INCHES NOMINAL IN, overall_length: 1.650 INCHES MINIMUM IN, mounting_method: MOUNTING SLOTS. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-971-6323, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| width | 0.440 INCHES NOMINAL IN |
| length | 1.499 INCHES NOMINAL IN |
| material | COPPER ALLOY OVERALL |
| overall_height | 0.180 INCHES NOMINAL IN |
| overall_length | 1.650 INCHES MINIMUM IN |
| mounting_method | MOUNTING SLOTS |
| overall_diameter | 0.635 INCHES NOMINAL IN |
| features_provided | HERMETICALLY SEALED CASE |
| surface_treatment | LEAD AND TIN OVERALL |
| material_thickness | 0.010 INCHES NOMINAL IN |
| nominal_thread_size | 0.250 INCHES IN |
| thread_series_designator | UNF |
| NSN | 5961-00-971-6323 |
| NOMINAL THREAD SIZE | 0.250 INCHES IN |
| MOUNTING FACILITY QUANTITY | 1 |
| TERMINAL TYPE AND QUANTITY | 1 TAB, SOLDER LUG AND 1 THREADED STUD |
| THREAD SERIES DESIGNATOR | UNF |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 175.0 CELSIUS CASE DEGC |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| MOUNTING METHOD | THREADED STUD(S) |
| MATERIAL | SILICON SEMICONDUCTOR |
| OVERALL LENGTH | 1.650 INCHES MINIMUM IN |
| OVERALL DIAMETER | 0.635 INCHES NOMINAL IN |