340928-4302: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.325 INCHES MAXIMUM IN, body_height: 0.276 INCHES MAXIMUM IN, body_length: 1.000 INCHES MAXIMUM IN, features_provided: PROGRAMMED AND MONOLITHIC AND BURN IN AND HERMETICALLY SEALED, inclosure_material: CERAMIC, memory_device_type: PROM. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-263-5902, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.325 INCHES MAXIMUM IN |
| body_height | 0.276 INCHES MAXIMUM IN |
| body_length | 1.000 INCHES MAXIMUM IN |
| features_provided | PROGRAMMED AND MONOLITHIC AND BURN IN AND HERMETICALLY SEALED |
| inclosure_material | CERAMIC |
| memory_device_type | PROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| time_rating_per_chacteristic | 65.00 NANOSECONDS MAXIMUM ACCESS NS |
| NSN | 5962-01-263-5902 |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.325 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.276 INCHES MAXIMUM IN |
| FEATURES PROVIDED | PROGRAMMED AND MONOLITHIC AND BURN IN AND HERMETICALLY SEALED |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| MEMORY DEVICE TYPE | PROM |
| BODY LENGTH | 1.000 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |