R29653ADM — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

R29653ADM: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.325 INCHES MAXIMUM IN, body_height: 0.276 INCHES MAXIMUM IN, body_length: 1.000 INCHES MAXIMUM IN, features_provided: PROGRAMMED AND MONOLITHIC AND BURN IN AND HERMETICALLY SEALED, inclosure_material: CERAMIC, memory_device_type: PROM. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-263-5880, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

R29653ADM

NSN: 5962-01-263-5880
NIINs: 012635880, 012635892, 012635902
FSC: 5962 — Microcircuits, Electronic
CAGE: 49956 — RAYTHEON COMPANY DIV CORP (USA)

SPECIFICATIONS

body_width	0.325 INCHES MAXIMUM IN
body_height	0.276 INCHES MAXIMUM IN
body_length	1.000 INCHES MAXIMUM IN
features_provided	PROGRAMMED AND MONOLITHIC AND BURN IN AND HERMETICALLY SEALED
inclosure_material	CERAMIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
time_rating_per_chacteristic	65.00 NANOSECONDS MAXIMUM ACCESS NS
NSN	5962-01-263-5880

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.325 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.276 INCHES MAXIMUM IN

•

FEATURES PROVIDED: PROGRAMMED AND BURN IN AND HERMETICALLY SEALED AND MONOLITHIC

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: PROM

•

BODY LENGTH: 1.000 INCHES MAXIMUM IN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.325 INCHES MAXIMUM IN
BODY HEIGHT	0.276 INCHES MAXIMUM IN
FEATURES PROVIDED	PROGRAMMED AND BURN IN AND HERMETICALLY SEALED AND MONOLITHIC
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	PROM
BODY LENGTH	1.000 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	7.0 VOLTS MAXIMUM POWER SOURCE

SUBSTITUTES & CROSS-REFERENCES 2

340939Reference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROM FAMILY 188Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is R29653ADM?

R29653ADM is a MICROCIRCUIT,MEMORY.

What parts can replace R29653ADM?

There are 2 known substitutes for R29653ADM: 340939, ROM/PROM FAMILY 188. Substitute compatibility should be verified for your specific system.

What is the NSN for R29653ADM?

R29653ADM is cataloged in the U.S. Government catalog under NSN 5962-01-263-5880. This indicates validated use in U.S. government and defense supply chains.

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