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Technical Data Sheet

332967-1 — Technical Data Sheet

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WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: BIPOLAR AND 3-STATE OUTPUT, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: ROM, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, input_circuit_pattern: 14 INPUT. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System under NSN 5962-01-235-6055, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
332967-1
NSN: 5962-01-235-6055
FSC: 5962
CAGE: 80249 — BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC. (USA)
SPECIFICATIONS
features_providedBIPOLAR AND 3-STATE OUTPUT
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern14 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
NSN5962-01-235-6055
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 332967-1 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
TERMINAL SURFACE TREATMENT: SOLDER
•
MEMORY DEVICE TYPE: ROM
•
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
•
INCLOSURE MATERIAL: CERAMIC
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
•
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
•
FEATURES PROVIDED: BIPOLAR AND 3-STATE OUTPUT
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
TERMINAL SURFACE TREATMENTSOLDER
MEMORY DEVICE TYPEROM
TERMINAL TYPE AND QUANTITY24 PRINTED CIRCUIT
INCLOSURE MATERIALCERAMIC
INCLOSURE CONFIGURATIONDUAL-IN-LINE
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
OUTPUT LOGIC FORMTRANSISTOR-TRANSISTOR LOGIC
FEATURES PROVIDEDBIPOLAR AND 3-STATE OUTPUT
INPUT CIRCUIT PATTERN14 INPUT
VERIFIED SUBSTITUTES & CROSS-REFERENCES 15
N82S181FInterchangeableGOVERNMENT REGISTRY
interchangeable cross-reference
interchangeable
BM1010-700InterchangeableGOVERNMENT REGISTRY
interchangeable cross-reference
interchangeable
312213-001InterchangeableGOVERNMENT REGISTRY
interchangeable cross-reference
interchangeable
161905InterchangeableGOVERNMENT REGISTRY
interchangeable cross-reference
interchangeable
ROM/PROM FAMILY 028InterchangeableGOVERNMENT REGISTRY
interchangeable cross-reference
interchangeable
M38510/20904BJXInterchangeableGOVERNMENT REGISTRY
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVEGOVERNMENT REGISTRY
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 332967-1?
332967-1 is a MICROCIRCUIT,MEMORY.
What parts can replace 332967-1?
There are 15 known substitutes for 332967-1: N82S181F, BM1010-700, 312213-001 and 12 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 332967-1?
332967-1 is cataloged in the Federal Logistics Information System under NSN 5962-01-235-6055. This indicates validated use in U.S. government and defense supply chains.
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