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Technical Data Sheet
PartsTable / COMPONENT / 3150740-931-103
3150740-931-103 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.600 INCHES MAXIMUM IN, body_height: 0.205 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, overall_height: 0.375 INCHES NOMINAL IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND HIGH SPEED. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-140-1654, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
3150740-931-103
NSN: 5962-01-140-1654
FSC: 5962
CAGE: 25500 — LOCKHEED MARTIN CORPORATION DBA LOCKHEED MARTIN DIV ROTARY AND MISSION SYSTEMS (USA)
SPECIFICATIONS
body_width0.600 INCHES MAXIMUM IN
body_height0.205 INCHES MAXIMUM IN
body_length1.290 INCHES MAXIMUM IN
overall_height0.375 INCHES NOMINAL IN
memory_capacityUNKNOWN
features_providedHERMETICALLY SEALED AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND HIGH SPEED
output_logic_formN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern12 INPUT
NSN5962-01-140-1654
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 3150740-931-103 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
MAXIMUM POWER DISSIPATION RATING: 720.0 MILLIWATTS
•
MEMORY DEVICE TYPE: ROM
•
MEMORY CAPACITY: UNKNOWN
•
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
•
TIME RATING PER CHACTERISTIC: 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
•
TERMINAL SURFACE TREATMENT: SOLDER
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.3 VOLTS MINIMUM POWER SOURCE AND 20.0 VOLTS MAXIMUM POWER SOURCE
•
BODY LENGTH: 1.290 INCHES MAXIMUM IN
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
MAXIMUM POWER DISSIPATION RATING720.0 MILLIWATTS
MEMORY DEVICE TYPEROM
MEMORY CAPACITYUNKNOWN
TERMINAL TYPE AND QUANTITY24 PRINTED CIRCUIT
TIME RATING PER CHACTERISTIC450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
TERMINAL SURFACE TREATMENTSOLDER
VOLTAGE RATING AND TYPE PER CHARACTERISTIC-0.3 VOLTS MINIMUM POWER SOURCE AND 20.0 VOLTS MAXIMUM POWER SOURCE
BODY LENGTH1.290 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
INCLOSURE MATERIALCERAMIC
VERIFIED SUBSTITUTES & CROSS-REFERENCES 14
86327Interchangeable
interchangeable cross-reference
interchangeable
213Z111U01Interchangeable
interchangeable cross-reference
interchangeable
TMS2716-45JLInterchangeable
interchangeable cross-reference
interchangeable
3150740-930-103Interchangeable
interchangeable cross-reference
interchangeable
ROM/PROM FAMILY 009Interchangeable
interchangeable cross-reference
interchangeable
3150740-932-103Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 3150740-931-103?
3150740-931-103 is a MICROCIRCUIT,MEMORY.
What parts can replace 3150740-931-103?
There are 14 known substitutes for 3150740-931-103: 86327, 213Z111U01, TMS2716-45JL and 11 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 3150740-931-103?
3150740-931-103 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-140-1654. This indicates validated use in U.S. government and defense supply chains.
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Last verified: July 2026