The TRANSISTOR is a the manufacturer industrial component. Key specifications include overall_length: 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN, mounting_method: THREADED STUD(S), features_provided: HERMETICALLY SEALED CASE, nominal_thread_size: 0.190 INCHES IN, internal_configuration: JUNCTION CONTACT, semiconductor_material: SILICON. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-479-1382, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| overall_length | 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN |
| mounting_method | THREADED STUD(S) |
| features_provided | HERMETICALLY SEALED CASE |
| nominal_thread_size | 0.190 INCHES IN |
| internal_configuration | JUNCTION CONTACT |
| semiconductor_material | SILICON |
| thread_series_designator | UNF |
| mounting_facility_quantity | 1 |
| overall_width_across_flats | 0.440 INCHES MAXIMUM IN |
| terminal_type_and_quantity | 3 PIN |
| internal_junction_configuration | NPN |
| power_rating_per_characteristic | 11.6 WATTS MAXIMUM COLLECTOR POWER DISSIPATION |
| NSN | 5961-00-479-1382 |
| TERMINAL TYPE AND QUANTITY | 3 PIN |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| INTERNAL JUNCTION CONFIGURATION | NPN |
| MOUNTING FACILITY QUANTITY | 1 |
| SEMICONDUCTOR MATERIAL | SILICON |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 CELSIUS CASE DEGC |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 65.0 MAXIMUM BREAKDOWN VOLTAGE, COLLECTOR-TO-BASE, EMITTER OPEN AND 40.0 MAXIMUM BREAKDOWN VOLTAGE, COLLECTOR-TO-EMITTER, BASE OPEN AND 4.0 MAXIMUM BREAKDOWN VOLTAGE, EMITTER-TO-BASE, COLLECTOR OPEN |
| MOUNTING METHOD | THREADED STUD(S) |
| OVERALL WIDTH ACROSS FLATS | 0.440 INCHES MAXIMUM IN |
| NOMINAL THREAD SIZE | 0.190 INCHES IN |