The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include overall_height: 0.245 INCHES MINIMUM AND 0.295 INCHES MAXIMUM IN, overall_length: 0.245 INCHES MINIMUM AND 0.295 INCHES MAXIMUM IN, transfer_ratio: 150.0 MAXIMUM STATIC FORWARD CURRENT TRANSFER RATIO, COMMON-EMITTER, mounting_method: THREADED STUD(S), special_features: JUNCTION PATTERN ARRANGEMENT: NPN, features_provided: HERMETICALLY SEALED CASE. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-01-026-8939, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| overall_height | 0.245 INCHES MINIMUM AND 0.295 INCHES MAXIMUM IN |
| overall_length | 0.245 INCHES MINIMUM AND 0.295 INCHES MAXIMUM IN |
| transfer_ratio | 150.0 MAXIMUM STATIC FORWARD CURRENT TRANSFER RATIO, COMMON-EMITTER |
| mounting_method | THREADED STUD(S) |
| special_features | JUNCTION PATTERN ARRANGEMENT: NPN |
| features_provided | HERMETICALLY SEALED CASE |
| nominal_thread_size | 0.190 INCHES IN |
| internal_configuration | JUNCTION CONTACT |
| semiconductor_material | SILICON |
| thread_series_designator | UNF |
| mounting_facility_quantity | 1 |
| overall_width_across_flats | 0.420 INCHES MINIMUM AND 0.440 INCHES MAXIMUM IN |
| NSN | 5961-01-026-8939 |