29894-00 — Technical Data Sheet

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— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, overall_height: 0.400 INCHES MAXIMUM IN, overall_length: 1.060 INCHES MAXIMUM IN, features_provided: HIGH IMPEDANCE AND MONOLITHIC AND W/CLOCK AND W/ENABLE AND W/DISABLE AND ELECTROSTATIC SENSITIVE. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-351-4969, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

29894-00

NSN: 5962-01-351-4969
FSC: 5962
CAGE: 11627 — L3 TECHNOLOGIES, INC. DIV COMMUNICATION SYSTEMS-WEST (USA)

SPECIFICATIONS

body_width	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length	1.060 INCHES MAXIMUM IN
overall_height	0.400 INCHES MAXIMUM IN
overall_length	1.060 INCHES MAXIMUM IN
features_provided	HIGH IMPEDANCE AND MONOLITHIC AND W/CLOCK AND W/ENABLE AND W/DISABLE AND ELECTROSTATIC SENSITIVE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
NSN	5962-01-351-4969

COMPONENT DIAGRAM

KEY FEATURES

•

BODY HEIGHT: 0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN

•

TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

•

FEATURES PROVIDED: HIGH IMPEDANCE AND MONOLITHIC AND W/CLOCK AND W/ENABLE AND W/DISABLE AND ELECTROSTATIC SENSITIVE

•

BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN

•

TERMINAL TYPE AND QUANTITY: 20 PRINTED CIRCUIT

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CURRENT RATING PER CHARACTERISTIC: 50.00 MILLIAMPERES MAXIMUM SUPPLY

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MAXIMUM POWER DISSIPATION RATING: 300.0 MILLIWATTS

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

BODY HEIGHT	0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
FEATURES PROVIDED	HIGH IMPEDANCE AND MONOLITHIC AND W/CLOCK AND W/ENABLE AND W/DISABLE AND ELECTROSTATIC SENSITIVE
BODY WIDTH	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
TERMINAL TYPE AND QUANTITY	20 PRINTED CIRCUIT
OVERALL LENGTH	1.060 INCHES MAXIMUM IN
CURRENT RATING PER CHARACTERISTIC	50.00 MILLIAMPERES MAXIMUM SUPPLY
MAXIMUM POWER DISSIPATION RATING	300.0 MILLIWATTS
TERMINAL SURFACE TREATMENT	SOLDER
END ITEM IDENTIFICATION	SATELLITE COMMUNICATIONS TERMINAL AN/USC-38(V)1

VERIFIED SUBSTITUTES & CROSS-REFERENCES 11

8506503RAInterchangeable