The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: ALUMINUM ALLOY, overall_length: 2.600 INCHES NOMINAL IN, mounting_method: THREADED STUD(S), overall_diameter: 2.613 INCHES MINIMUM AND 2.615 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED CASE, surface_treatment: ANODIZE. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 1650-00-657-8353, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | ALUMINUM ALLOY |
| overall_length | 2.600 INCHES NOMINAL IN |
| mounting_method | THREADED STUD(S) |
| overall_diameter | 2.613 INCHES MINIMUM AND 2.615 INCHES MAXIMUM IN |
| special_features | ALT MATERIAL ALUMINUM ALLOY CASTING PER ASTM A356-16;IAW MIL-STD-2175 CLASS 3 GRADE C;NEXT ASSEMBLY 211920 USED ON 211844-3 |
| features_provided | HERMETICALLY SEALED CASE |
| surface_treatment | ANODIZE |
| nominal_thread_size | 0.190 INCHES IN |
| end_item_identification | RECEPTION COUPLING |
| thread_series_designator | UNF |
| mounting_facility_quantity | 1 |
| overall_width_across_flats | 0.424 INCHES MINIMUM AND 0.437 INCHES MAXIMUM IN |
| NSN | 1650-00-657-8353 |
| GENERAL CHARACTERISTICS ITEM DESCRIPTION | STEEL,ZINC PLATE,4.125 IN. LG,0.703 IN. W,0.468 IN. THK,2 HOLES 0.343 IN. DIA,3.536 IN. C TO C DISTANCE IN |