The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.800 INCHES MAXIMUM IN, mounting_method: THREADED STUD(S), overall_diameter: 0.424 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED CASE, nominal_thread_size: 0.190 INCHES IN. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-931-0437, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_length | 0.800 INCHES MAXIMUM IN |
| mounting_method | THREADED STUD(S) |
| overall_diameter | 0.424 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED CASE |
| nominal_thread_size | 0.190 INCHES IN |
| semiconductor_material | SILICON |
| thread_series_designator | UNF |
| mounting_facility_quantity | 1 |
| overall_width_across_flats | 0.430 INCHES NOMINAL IN |
| terminal_type_and_quantity | 1 THREADED STUD AND 1 TAB, SOLDER LUG |
| specification/standard_data | 81349-MIL-S-19500/304 GOVERNMENT SPECIFICATION |
| NSN | 5961-00-931-0437 |
| TERMINAL TYPE AND QUANTITY | 1 THREADED STUD AND 1 TAB, SOLDER LUG |
| SPECIFICATION/STANDARD DATA | 81349-MIL-S-19500/304 GOVERNMENT SPECIFICATION |
| MOUNTING METHOD | THREADED STUD(S) |
| NOMINAL THREAD SIZE | 0.190 INCHES IN |
| THREAD SERIES DESIGNATOR | UNF |
| OVERALL DIAMETER | 0.424 INCHES MAXIMUM IN |
| OVERALL WIDTH ACROSS FLATS | 0.424 INCHES MINIMUM AND 0.437 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CURRENT RATING PER CHARACTERISTIC | 12.00 AMPERES MAXIMUM AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE |
| MOUNTING FACILITY QUANTITY | 1 |