Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: 1818-0203

1818-0203 ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.580 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN, body_length: 1.180 INCHES MINIMUM AND 1.220 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND PROGRAMMABLE AND 3-STATE OUTPUT, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-110-7719, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

1818-0203

NSN: 5962-01-110-7719
FSC: 5962
CAGE: 28480 — HEWLETT-PACKARD COMPANY DBA HP (USA)

SPECIFICATIONS

body_width	0.580 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height	0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN
body_length	1.180 INCHES MINIMUM AND 1.220 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND PROGRAMMABLE AND 3-STATE OUTPUT
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	13 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-110-7719

COMPONENT DIAGRAM

KEY FEATURES

•

OPERATING TEMP RANGE: +0.0 TO 70.0 CELSIUS DEGC

•

OUTPUT LOGIC FORM: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC

•

MEMORY CAPACITY: UNKNOWN

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TERMINAL SURFACE TREATMENT: SOLDER

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE

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MEMORY DEVICE TYPE: ROM

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TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT

•

INPUT CIRCUIT PATTERN: 13 INPUT

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

OPERATING TEMP RANGE	+0.0 TO 70.0 CELSIUS DEGC
OUTPUT LOGIC FORM	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
MEMORY CAPACITY	UNKNOWN
TERMINAL SURFACE TREATMENT	SOLDER
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	7.0 VOLTS MAXIMUM POWER SOURCE
MEMORY DEVICE TYPE	ROM
TERMINAL TYPE AND QUANTITY	24 PRINTED CIRCUIT
INPUT CIRCUIT PATTERN	13 INPUT
BODY HEIGHT	0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN
BODY WIDTH	0.580 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN

VERIFIED SUBSTITUTES & CROSS-REFERENCES 17

1818-0208Interchangeable