168956-01 — Technical Data Sheet

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— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-371-1028, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

168956-01

NSN: 5962-01-371-1028
FSC: 5962
CAGE: 35351 — GE AVIATION SYSTEMS LLC (USA)

SPECIFICATIONS

body_width	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.185 INCHES MAXIMUM IN
body_length	1.060 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMABLE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	12 INPUT
end_item_identification	5895-01-305-8863
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-371-1028

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

MAXIMUM POWER DISSIPATION RATING: 300.0 MILLIWATTS

•

TERMINAL TYPE AND QUANTITY: 20 PRINTED CIRCUIT

•

TIME RATING PER CHACTERISTIC: 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS

•

BODY LENGTH: 1.060 INCHES MAXIMUM IN

•

OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC

•

BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

INCLOSURE MATERIAL	CERAMIC
MAXIMUM POWER DISSIPATION RATING	300.0 MILLIWATTS
TERMINAL TYPE AND QUANTITY	20 PRINTED CIRCUIT
TIME RATING PER CHACTERISTIC	75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
BODY LENGTH	1.060 INCHES MAXIMUM IN
END ITEM IDENTIFICATION	5895-01-305-8863
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
BODY WIDTH	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
CASE OUTLINE SOURCE AND DESIGNATOR	D-8 MIL-M-38510
TEST DATA DOCUMENT	35351-168956 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING)

VERIFIED SUBSTITUTES & CROSS-REFERENCES 12

8506503RAInterchangeable