168541-13 — Technical Data Sheet

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— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, body_height: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, body_length: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: PAL. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-370-8092, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

168541-13

NSN: 5962-01-370-8092
FSC: 5962
CAGE: 35351 — GE AVIATION SYSTEMS LLC (USA)

SPECIFICATIONS

body_width	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
body_height	0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
body_length	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
features_provided	BIDIRECTIONAL AND W/CLOCK AND HIGH IMPEDANCE AND W/ENABLE AND W/DISABLE AND BIPOLAR AND PROGRAMMED AND 3-STATE OUTPUT AND ELECTROSTATIC SENSITIVE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	16 INPUT
end_item_identification	5895-01-305-8863 RECORDER,SIGNAL DATA
NSN	5962-01-370-8092

COMPONENT DIAGRAM

KEY FEATURES

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CASE OUTLINE SOURCE AND DESIGNATOR: C-2 MIL-M-38510

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TIME RATING PER CHACTERISTIC: 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT NS

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TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

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FEATURES PROVIDED: BIDIRECTIONAL AND W/CLOCK AND HIGH IMPEDANCE AND W/ENABLE AND W/DISABLE AND BIPOLAR AND PROGRAMMED AND 3-STATE OUTPUT AND ELECTROSTATIC SENSITIVE

•

INCLOSURE MATERIAL: CERAMIC

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STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

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MAXIMUM POWER DISSIPATION RATING: 300.0 MILLIWATTS

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

CASE OUTLINE SOURCE AND DESIGNATOR	C-2 MIL-M-38510
PART NAME ASSIGNED BY CONTROLLING AGENCY	AND-OR INVERT GATE ARRAY
TIME RATING PER CHACTERISTIC	75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT NS
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
FEATURES PROVIDED	BIDIRECTIONAL AND W/CLOCK AND HIGH IMPEDANCE AND W/ENABLE AND W/DISABLE AND BIPOLAR AND PROGRAMMED AND 3-STATE OUTPUT AND ELECTROSTATIC SENSITIVE
INCLOSURE MATERIAL	CERAMIC
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
MAXIMUM POWER DISSIPATION RATING	300.0 MILLIWATTS
BODY WIDTH	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC

VERIFIED SUBSTITUTES & CROSS-REFERENCES 9

85065012BInterchangeable