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12703358 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

12703358: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES NOMINAL IN, body_length: 0.960 INCHES MAXIMUM IN, bit_quantity: 4096, word_quantity: 4096, features_provided: ELECTROSTATIC SENSITIVE AND MONOLITHIC AND HERMETICALLY SEALED. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-156-8655, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
12703358
NSN: 5962-01-156-8655
FSC: 5962 — Microcircuits, Electronic
CAGE: 19200 — COMBAT CAPABILITIES DEVELOPMENT COMMAND (CCDC) ARMAMENTS CENTER DBA CCDC DIV LOGISTICS RESEARCH AND ENGINEERING DIRECTORATE (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.185 INCHES NOMINAL IN
body_length0.960 INCHES MAXIMUM IN
bit_quantity4096
word_quantity4096
features_providedELECTROSTATIC SENSITIVE AND MONOLITHIC AND HERMETICALLY SEALED
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeRAM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
NSN5962-01-156-8655
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 12703358 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
BIT QUANTITY: 4096
•
INPUT CIRCUIT PATTERN: 15 INPUT
•
WORD QUANTITY: 4096
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.185 INCHES NOMINAL IN
•
FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND MONOLITHIC AND HERMETICALLY SEALED
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
BIT QUANTITY4096
INPUT CIRCUIT PATTERN15 INPUT
WORD QUANTITY4096
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT0.185 INCHES NOMINAL IN
FEATURES PROVIDEDELECTROSTATIC SENSITIVE AND MONOLITHIC AND HERMETICALLY SEALED
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPERAM
SUBSTITUTES & CROSS-REFERENCES 1
HM1-6504-8Reference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Demilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is 12703358?
12703358 is a MICROCIRCUIT,MEMORY.
What parts can replace 12703358?
There is 1 known substitute for 12703358: HM1-6504-8. Substitute compatibility should be verified for your specific system.
What is the NSN for 12703358?
12703358 is cataloged in the U.S. Government catalog under NSN 5962-01-156-8655. This indicates validated use in U.S. government and defense supply chains.
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