HM1-6504-8 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

HM1-6504-8: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.295 INCHES NOMINAL IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 0.900 INCHES NOMINAL IN, bit_quantity: 4096, word_quantity: 4096, memory_capacity: UNKNOWN. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-138-0755, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

HM1-6504-8

NSN: 5962-01-138-0755
NIINs: 011380755, 011568655
FSC: 5962 — Microcircuits, Electronic
CAGE: 34371 — RENESAS ELECTRONICS AMERICA INC (USA)

SPECIFICATIONS

body_width	0.295 INCHES NOMINAL IN
body_height	0.185 INCHES MAXIMUM IN
body_length	0.900 INCHES NOMINAL IN
bit_quantity	4096
word_quantity	4096
memory_capacity	UNKNOWN
features_provided	LOW POWER AND 3-STATE OUTPUT AND HIGH PERFORMANCE AND BURN IN AND HERMETICALLY SEALED AND STATIC OPERATION
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
NSN	5962-01-138-0755

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 15 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.295 INCHES NOMINAL IN

•

BODY HEIGHT: 0.185 INCHES MAXIMUM IN

•

FEATURES PROVIDED: LOW POWER AND 3-STATE OUTPUT AND HIGH PERFORMANCE AND BURN IN AND HERMETICALLY SEALED AND STATIC OPERATION

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: RAM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	15 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.295 INCHES NOMINAL IN
BODY HEIGHT	0.185 INCHES MAXIMUM IN
FEATURES PROVIDED	LOW POWER AND 3-STATE OUTPUT AND HIGH PERFORMANCE AND BURN IN AND HERMETICALLY SEALED AND STATIC OPERATION
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	RAM
BODY LENGTH	0.900 INCHES NOMINAL IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 1

AM0005-001Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is HM1-6504-8?

HM1-6504-8 is a MICROCIRCUIT,MEMORY.

What parts can replace HM1-6504-8?

There is 1 known substitute for HM1-6504-8: AM0005-001. Substitute compatibility should be verified for your specific system.

What is the NSN for HM1-6504-8?

HM1-6504-8 is cataloged in the U.S. Government catalog under NSN 5962-01-138-0755. This indicates validated use in U.S. government and defense supply chains.

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