Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: 1086870P11

1086870P11 ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.185 INCHES NOMINAL IN, body_length: 0.750 INCHES MINIMUM AND 0.865 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND PROGRAMMABLE AND W/ENABLE AND 3-STATE OUTPUT AND SCHOTTKY, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-159-2497, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

1086870P11

NSN: 5962-01-159-2497
FSC: 5962
CAGE: 94117 — BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC. DBA BAE SYSTEMS (USA)

SPECIFICATIONS

body_width	0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
body_height	0.185 INCHES NOMINAL IN
body_length	0.750 INCHES MINIMUM AND 0.865 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND PROGRAMMABLE AND W/ENABLE AND 3-STATE OUTPUT AND SCHOTTKY
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 75.0 CELSIUS DEGC
input_circuit_pattern	6 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-159-2497

COMPONENT DIAGRAM

KEY FEATURES

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MEMORY DEVICE TYPE: ROM

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TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT

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TIME RATING PER CHACTERISTIC: 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT NS

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VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS MAXIMUM POWER SOURCE

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MEMORY CAPACITY: UNKNOWN

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TERMINAL SURFACE TREATMENT: SOLDER

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OPERATING TEMP RANGE: +0.0 TO 75.0 CELSIUS DEGC

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INCLOSURE MATERIAL: CERAMIC

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

MEMORY DEVICE TYPE	ROM
TERMINAL TYPE AND QUANTITY	16 PRINTED CIRCUIT
TIME RATING PER CHACTERISTIC	30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT NS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	5.5 VOLTS MAXIMUM POWER SOURCE
MEMORY CAPACITY	UNKNOWN
TERMINAL SURFACE TREATMENT	SOLDER
OPERATING TEMP RANGE	+0.0 TO 75.0 CELSIUS DEGC
INCLOSURE MATERIAL	CERAMIC
BODY WIDTH	0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN	6 INPUT

VERIFIED SUBSTITUTES & CROSS-REFERENCES 19

ROM/PROMInterchangeable