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Technical Data Sheet
PartsTable / COMPONENT / 1086870P3
1086870P3 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.200 INCHES MAXIMUM IN, body_length: 0.750 INCHES MINIMUM AND 0.865 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BIPOLAR AND PROGRAMMED AND MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-060-6318, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
1086870P3
NSN: 5962-01-060-6318
FSC: 5962
CAGE: 94117 — BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC. DBA BAE SYSTEMS (USA)
SPECIFICATIONS
body_width0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
body_height0.200 INCHES MAXIMUM IN
body_length0.750 INCHES MINIMUM AND 0.865 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND BIPOLAR AND PROGRAMMED AND MONOLITHIC
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range+0.0 TO 75.0 CELSIUS DEGC
input_circuit_pattern6 INPUT
end_item_identificationC5-A
inclosure_configurationDUAL-IN-LINE
NSN5962-01-060-6318
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 1086870P3 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
BODY WIDTH: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
•
TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT
•
MEMORY DEVICE TYPE: PROM
•
TIME RATING PER CHACTERISTIC: 50.00 NANOSECONDS MAXIMUM ACCESS NS
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE
•
TERMINAL SURFACE TREATMENT: SOLDER
•
CURRENT RATING PER CHARACTERISTIC: 125.00 MILLIAMPERES MAXIMUM SUPPLY
•
INCLOSURE MATERIAL: CERAMIC
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
BODY WIDTH0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
TERMINAL TYPE AND QUANTITY16 PRINTED CIRCUIT
MEMORY DEVICE TYPEPROM
TIME RATING PER CHACTERISTIC50.00 NANOSECONDS MAXIMUM ACCESS NS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC7.0 VOLTS MAXIMUM POWER SOURCE
TERMINAL SURFACE TREATMENTSOLDER
CURRENT RATING PER CHARACTERISTIC125.00 MILLIAMPERES MAXIMUM SUPPLY
INCLOSURE MATERIALCERAMIC
INPUT CIRCUIT PATTERN6 INPUT
INCLOSURE CONFIGURATIONDUAL-IN-LINE
VERIFIED SUBSTITUTES & CROSS-REFERENCES 19
ROM/PROMInterchangeable
interchangeable cross-reference
interchangeable
6331-1JInterchangeable
interchangeable cross-reference
interchangeable
1086870P1Interchangeable
interchangeable cross-reference
interchangeable
1086870P5Interchangeable
interchangeable cross-reference
interchangeable
1086870P6Interchangeable
interchangeable cross-reference
interchangeable
1086870P006Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 1086870P3?
1086870P3 is a MICROCIRCUIT,MEMORY.
What parts can replace 1086870P3?
There are 19 known substitutes for 1086870P3: ROM/PROM, 6331-1J, 1086870P1 and 16 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 1086870P3?
1086870P3 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-060-6318. This indicates validated use in U.S. government and defense supply chains.
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Last verified: July 2026