10133958 — Technical Data Sheet

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— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 1.280 INCHES MAXIMUM IN, features_provided: ELECTROSTATIC SENSITIVE AND PROGRAMMED AND BIPOLAR AND W/ENABLE AND W/DISABLE AND W/CLOCK AND MONOLITHIC, inclosure_material: CERAMIC, memory_device_type: PAL. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-290-1583, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

10133958

NSN: 5962-01-290-1583
FSC: 5962
CAGE: A486G — NIMIKKEISTOKESKUS NCB FINLAND (FIN)

SPECIFICATIONS

body_width	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length	1.280 INCHES MAXIMUM IN
features_provided	ELECTROSTATIC SENSITIVE AND PROGRAMMED AND BIPOLAR AND W/ENABLE AND W/DISABLE AND W/CLOCK AND MONOLITHIC
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	16 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-290-1583

COMPONENT DIAGRAM

KEY FEATURES

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BODY LENGTH: 1.280 INCHES MAXIMUM IN

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TERMINAL TYPE AND QUANTITY: 20 PRINTED CIRCUIT

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VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE

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FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND PROGRAMMED AND BIPOLAR AND W/ENABLE AND W/DISABLE AND W/CLOCK AND MONOLITHIC

•

OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC

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CURRENT RATING PER CHARACTERISTIC: 50.00 MILLIAMPERES MAXIMUM SUPPLY

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INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: PAL

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

BODY LENGTH	1.280 INCHES MAXIMUM IN
TERMINAL TYPE AND QUANTITY	20 PRINTED CIRCUIT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
FEATURES PROVIDED	ELECTROSTATIC SENSITIVE AND PROGRAMMED AND BIPOLAR AND W/ENABLE AND W/DISABLE AND W/CLOCK AND MONOLITHIC
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
CURRENT RATING PER CHARACTERISTIC	50.00 MILLIAMPERES MAXIMUM SUPPLY
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	PAL
INCLOSURE MATERIAL	CERAMIC
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

VERIFIED SUBSTITUTES & CROSS-REFERENCES 20

8506503RAInterchangeable