10133819 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

10133819: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM IN, body_height: 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN, body_length: 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM IN, features_provided: BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-298-6812, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

10133819

NSN: 5962-01-298-6812
FSC: 5962 — Microcircuits, Electronic
CAGE: A486G — NIMIKKEISTOKESKUS NCB FINLAND (FIN)

SPECIFICATIONS

body_width	0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM IN
body_height	0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN
body_length	0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM IN
features_provided	BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	16 INPUT
inclosure_configuration	LEADLESS FLAT PACK
NSN	5962-01-298-6812

COMPONENT DIAGRAM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

SUBSTITUTES & CROSS-REFERENCES 3

795072-1Reference document

Same NSN cross-reference

Reference document — Secondary reference

AM2764A-25BUCReference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROM FAMILY 155Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 10133819?

10133819 is a MICROCIRCUIT,MEMORY.

What parts can replace 10133819?

There are 3 known substitutes for 10133819: 795072-1, AM2764A-25BUC, ROM/PROM FAMILY 155. Substitute compatibility should be verified for your specific system.

What is the NSN for 10133819?

10133819 is cataloged in the U.S. Government catalog under NSN 5962-01-298-6812. This indicates validated use in U.S. government and defense supply chains.

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10133819 — MICROCIRCUIT,MEMORY

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