The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: PROGRAMMED, inclosure_material: CERAMIC, memory_device_type: ROM, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, inclosure_configuration: DUAL-IN-LINE, terminal_surface_treatment: SOLDER. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-330-7544, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| features_provided | PROGRAMMED |
| inclosure_material | CERAMIC |
| memory_device_type | ROM |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 28 PRINTED CIRCUIT |
| time_rating_per_chacteristic | 150.00 NANOSECONDS MAXIMUM ACCESS NS |
| voltage_rating_and_type_per_characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
| NSN | 5962-01-330-7544 |
| TIME RATING PER CHACTERISTIC | 150.00 NANOSECONDS MAXIMUM ACCESS NS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| MEMORY DEVICE TYPE | ROM |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
| INCLOSURE MATERIAL | CERAMIC |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| FEATURES PROVIDED | PROGRAMMED |