The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.610 INCHES MAXIMUM IN, body_height: 0.210 INCHES MAXIMUM IN, body_length: 1.490 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND W/ENABLE AND W/BUFFERED OUTPUT, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-264-5449, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.610 INCHES MAXIMUM IN |
| body_height | 0.210 INCHES MAXIMUM IN |
| body_length | 1.490 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND W/ENABLE AND W/BUFFERED OUTPUT |
| output_logic_form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | PROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 17 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| NSN | 5962-01-264-5449 |
| BODY LENGTH | 1.490 INCHES MAXIMUM IN |
| MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 0.6 VOLTS MINIMUM TOTAL SUPPLY AND 6.3 VOLTS MAXIMUM TOTAL SUPPLY |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CASE OUTLINE SOURCE AND DESIGNATOR | D-10 MIL-M-38510 |
| TERMINAL SURFACE TREATMENT | SOLDER |
| MEMORY DEVICE TYPE | PROM |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |