Z082013792: BUSHING,INSULATION.
The BUSHING,INSULATION is a the manufacturer industrial component. Key specifications include material: CERAMIC ENCLOSURE, overall_length: 0.640 INCHES NOMINAL IN, mounting_method: THREADED STUD(S), special_features: CERAMIC CASE CONTAINS BERYLLIUM OXIDE - HANDLE AND DISPOSE IAW HAZMAT PROCEDURES; JUNCTION PATTERN ARRANGEMENT: NPN, precious_material: GOLD, nominal_thread_size: 0.164 INCHES IN. This part is cataloged in the U.S.
Government catalog under NSN 5970-00-188-7198, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | CERAMIC ENCLOSURE |
| overall_length | 0.640 INCHES NOMINAL IN |
| mounting_method | THREADED STUD(S) |
| special_features | CERAMIC CASE CONTAINS BERYLLIUM OXIDE - HANDLE AND DISPOSE IAW HAZMAT PROCEDURES; JUNCTION PATTERN ARRANGEMENT: NPN |
| precious_material | GOLD |
| nominal_thread_size | 0.164 INCHES IN |
| internal_configuration | JUNCTION CONTACT |
| semiconductor_material | SILICON |
| thread_series_designator | UNIFIED NATIONAL COARSE (UNC) |
| mounting_facility_quantity | 1 |
| terminal_type_and_quantity | 4 RIBBON |
| precious_material_and_location | CHIP METALLIZATION AND INTERNAL @WIRES GOLD |
| NSN | 5970-00-188-7198 |