XR567PA883C — MICROCIRCUIT,LINEAR

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

XR567PA883C: MICROCIRCUIT,LINEAR.

The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_width: 0.244 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.130 INCHES MINIMUM AND 0.160 INCHES MAXIMUM IN, body_length: 0.393 INCHES MINIMUM AND 0.416 INCHES MAXIMUM IN, special_features: ESD, features_provided: ELECTROSTATIC SENSITIVE AND MONOLITHIC AND HERMETICALLY SEALED AND BURN IN, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-097-0555, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

XR567PA883C

NSN: 5962-01-097-0555
NIINs: 010970555, 013330230
FSC: 5962 — Microcircuits, Electronic
CAGE: 52063 — EXAR INTEGRATED SYSTEMS (USA)

SPECIFICATIONS

body_width	0.244 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
body_height	0.130 INCHES MINIMUM AND 0.160 INCHES MAXIMUM IN
body_length	0.393 INCHES MINIMUM AND 0.416 INCHES MAXIMUM IN
special_features	ESD
features_provided	ELECTROSTATIC SENSITIVE AND MONOLITHIC AND HERMETICALLY SEALED AND BURN IN
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	1 INPUT
end_item_identification	TACTICAL AIR OPERATIONS MODULE AN/TYQ-23(V)1
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-097-0555

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 1 INPUT

•

INCLOSURE MATERIAL: SILICON

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 1 DECODER

•

CRITICALITY CODE JUSTIFICATION: FEAT

•

FEATURES PROVIDED: PROGRAMMED AND MONOLITHIC AND BURN IN AND ELECTROSTATIC SENSITIVE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

CASE OUTLINE SOURCE AND DESIGNATOR: D-4 MIL-M-38510

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	1 INPUT
INCLOSURE MATERIAL	SILICON
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	1 DECODER
CRITICALITY CODE JUSTIFICATION	FEAT
FEATURES PROVIDED	PROGRAMMED AND MONOLITHIC AND BURN IN AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
CASE OUTLINE SOURCE AND DESIGNATOR	D-4 MIL-M-38510
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
SPECIAL FEATURES	ESD

SUBSTITUTES & CROSS-REFERENCES 1

567/BPAReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — mutilation

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FREQUENTLY ASKED QUESTIONS

What is XR567PA883C?

XR567PA883C is a MICROCIRCUIT,LINEAR.

What parts can replace XR567PA883C?

There is 1 known substitute for XR567PA883C: 567/BPA. Substitute compatibility should be verified for your specific system.

What is the NSN for XR567PA883C?

XR567PA883C is cataloged in the U.S. Government catalog under NSN 5962-01-097-0555. This indicates validated use in U.S. government and defense supply chains.

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XR567PA883C — MICROCIRCUIT,LINEAR

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