XC1765DDD8R — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

XC1765DDD8R: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.290 INCHES NOMINAL IN, body_height: 0.096 INCHES NOMINAL IN, body_length: 0.520 INCHES NOMINAL IN, features_provided: PROGRAMMABLE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-381-0138, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

XC1765DDD8R

NSN: 5962-01-381-0138
NIINs: 013810138, 013810320, 014003539, 014073934, 014076619, 014180572, 014180578, 014701351
FSC: 5962 — Microcircuits, Electronic
CAGE: 68894 — NEXUS INC OF PENSACOLA (USA)

SPECIFICATIONS

body_width	0.290 INCHES NOMINAL IN
body_height	0.096 INCHES NOMINAL IN
body_length	0.520 INCHES NOMINAL IN
features_provided	PROGRAMMABLE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PROGRAMMED
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	5 INPUT
end_item_identification	VMISC E/I FSCM 80132
NSN	5962-01-381-0138

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 5 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.290 INCHES NOMINAL IN

•

BODY HEIGHT: 0.096 INCHES NOMINAL IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND ELECTROSTATIC SENSITIVE AND PROGRAMMED

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

CURRENT RATING PER CHARACTERISTIC: 10.00 MILLIAMPERES MAXIMUM SUPPLY

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	5 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.290 INCHES NOMINAL IN
BODY HEIGHT	0.096 INCHES NOMINAL IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND ELECTROSTATIC SENSITIVE AND PROGRAMMED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
CURRENT RATING PER CHARACTERISTIC	10.00 MILLIAMPERES MAXIMUM SUPPLY
MEMORY DEVICE TYPE	PROM
BODY LENGTH	0.520 INCHES NOMINAL IN

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

26556-0168Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

Ready to buy XC1765DDD8R?

Compare prices from verified sellers on eBay

Buy on eBay →

As an eBay Partner, PartsTable may earn a commission. Your price is not affected.

FREQUENTLY ASKED QUESTIONS

What is XC1765DDD8R?

XC1765DDD8R is a MICROCIRCUIT,MEMORY.

What parts can replace XC1765DDD8R?

There are 2 known substitutes for XC1765DDD8R: ROM/PROM, 26556-0168. Substitute compatibility should be verified for your specific system.

What is the NSN for XC1765DDD8R?

XC1765DDD8R is cataloged in the U.S. Government catalog under NSN 5962-01-381-0138. This indicates validated use in U.S. government and defense supply chains.

Community Feedback

XC1765DDD8R — MICROCIRCUIT,MEMORY

Request a Quote — XC1765DDD8R