X5272: X5272.
The X5272 is a the manufacturer industrial component. Key specifications include special_features: PACKAGE 771 LAND FLIP CHIP, LAND GRID ARRAY (FC-LGA); 3.75 CM X 3.75 CM; 1600 MHZ MHz, supplementary_features: SOCKET 771/LGA 771; NUMBER OF CORES 2; LEVEL 2 CACHE SIZE-SHARED 6 MB CACHE MB, part_name_assigned_by_controlling_agency: INTEL XEON X5272 - EU80573KL0966M. This part is cataloged in the U.S.
Government catalog under NSN 7025-01-563-4757, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| special_features | PACKAGE 771 LAND FLIP CHIP, LAND GRID ARRAY (FC-LGA); 3.75 CM X 3.75 CM; 1600 MHZ MHz |
| supplementary_features | SOCKET 771/LGA 771; NUMBER OF CORES 2; LEVEL 2 CACHE SIZE-SHARED 6 MB CACHE MB |
| part_name_assigned_by_controlling_agency | INTEL XEON X5272 - EU80573KL0966M |
| NSN | 7025-01-563-4757 |
| SUPPLEMENTARY FEATURES | SOCKET 771/LGA 771; NUMBER OF CORES 2; LEVEL 2 CACHE SIZE-SHARED 6 MB CACHE MB |
| SPECIAL FEATURES | PACKAGE 771 LAND FLIP CHIP, LAND GRID ARRAY (FC-LGA); 3.75 CM X 3.75 CM; 1600 MHZ MHz |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | INTEL XEON X5272 - EU80573KL0966M |