X28HC256KMB-90 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

X28HC256KMB-90: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: BURN IN AND BIDIRECTIONAL AND MONOLITHIC AND PROGRAMMED, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: EEPROM, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-362-8122, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

X28HC256KMB-90

NSN: 5962-01-362-8122
FSC: 5962 — Microcircuits, Electronic
CAGE: 60395 — XICOR INC (USA)

SPECIFICATIONS

features_provided	BURN IN AND BIDIRECTIONAL AND MONOLITHIC AND PROGRAMMED
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	EEPROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	23 INPUT
inclosure_configuration	CAN
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	28 PIN
voltage_rating_and_type_per_characteristic	6.25 VOLTS MAXIMUM POWER SOURCE
NSN	5962-01-362-8122

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 23 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

FEATURES PROVIDED: BURN IN AND BIDIRECTIONAL AND MONOLITHIC AND PROGRAMMED

•

INCLOSURE CONFIGURATION: CAN

•

MEMORY DEVICE TYPE: EEPROM

•

STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

•

OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	23 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
FEATURES PROVIDED	BURN IN AND BIDIRECTIONAL AND MONOLITHIC AND PROGRAMMED
INCLOSURE CONFIGURATION	CAN
MEMORY DEVICE TYPE	EEPROM
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
OUTPUT LOGIC FORM	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	6.25 VOLTS MAXIMUM POWER SOURCE
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 7

5962-8863403UXReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8863403UASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8863403UBReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-88634Reference document

Same NSN cross-reference

Reference document — Identification reference

TM28HC256-90Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is X28HC256KMB-90?

X28HC256KMB-90 is a MICROCIRCUIT,MEMORY.

What parts can replace X28HC256KMB-90?

There are 7 known substitutes for X28HC256KMB-90: 5962-8863403UX, 5962-8863403UA, ROM/PROM and 4 more. Substitute compatibility should be verified for your specific system.

What is the NSN for X28HC256KMB-90?

X28HC256KMB-90 is cataloged in the U.S. Government catalog under NSN 5962-01-362-8122. This indicates validated use in U.S. government and defense supply chains.

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