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X28C256DMB-20 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

X28C256DMB-20: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.210 INCHES MAXIMUM IN, body_length: 1.490 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, special_features: NUCLEAR HARDNESS CRITICAL ITEM, features_provided: BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMED AND BIPOLAR. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-318-6685, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
X28C256DMB-20
NSN: 5962-01-318-6685
NIINs: 013186685, 013553768
FSC: 5962 — Microcircuits, Electronic
CAGE: 60395 — XICOR INC (USA)
SPECIFICATIONS
body_width0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height0.210 INCHES MAXIMUM IN
body_length1.490 INCHES MAXIMUM IN
memory_capacityUNKNOWN
special_featuresNUCLEAR HARDNESS CRITICAL ITEM
features_providedBURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMED AND BIPOLAR
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeEEPROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
NSN5962-01-318-6685
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN X28C256DMB-20 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 26 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.217 INCHES MAXIMUM IN
•
CRITICALITY CODE JUSTIFICATION: FEAT
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ERASABLE AND W/ENABLE
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN26 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
BODY HEIGHT0.217 INCHES MAXIMUM IN
CRITICALITY CODE JUSTIFICATIONFEAT
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ERASABLE AND W/ENABLE
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEROM
CASE OUTLINE SOURCE AND DESIGNATORD-10 MIL-M-38510
SUBSTITUTES & CROSS-REFERENCES 3
DM28C256-200/BReference document
Same NSN cross-reference
Reference document — Secondary reference
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8852504XAReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is X28C256DMB-20?
X28C256DMB-20 is a MICROCIRCUIT,MEMORY.
What parts can replace X28C256DMB-20?
There are 3 known substitutes for X28C256DMB-20: DM28C256-200/B, ROM/PROM, 5962-8852504XA. Substitute compatibility should be verified for your specific system.
What is the NSN for X28C256DMB-20?
X28C256DMB-20 is cataloged in the U.S. Government catalog under NSN 5962-01-318-6685. This indicates validated use in U.S. government and defense supply chains.
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