X2864AEMB-45 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

X2864AEMB-45: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.450 INCHES MAXIMUM IN, body_height: 0.085 INCHES MAXIMUM IN, body_length: 0.560 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ERASABLE AND W/BUFFERED OUTPUT AND BIDIRECTIONAL, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-264-4465, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

X2864AEMB-45

NSN: 5962-01-264-4465
FSC: 5962 — Microcircuits, Electronic
CAGE: 60395 — XICOR INC (USA)

SPECIFICATIONS

body_width	0.450 INCHES MAXIMUM IN
body_height	0.085 INCHES MAXIMUM IN
body_length	0.560 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ERASABLE AND W/BUFFERED OUTPUT AND BIDIRECTIONAL
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	24 INPUT
NSN	5962-01-264-4465

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 24 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.450 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.085 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ERASABLE AND W/BUFFERED OUTPUT AND BIDIRECTIONAL

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	24 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.450 INCHES MAXIMUM IN
BODY HEIGHT	0.085 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ERASABLE AND W/BUFFERED OUTPUT AND BIDIRECTIONAL
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.560 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 1

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — stock exhausted; no further procurementDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is X2864AEMB-45?

X2864AEMB-45 is a MICROCIRCUIT,MEMORY.

What parts can replace X2864AEMB-45?

There is 1 known substitute for X2864AEMB-45: ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for X2864AEMB-45?

X2864AEMB-45 is cataloged in the U.S. Government catalog under NSN 5962-01-264-4465. This indicates validated use in U.S. government and defense supply chains.

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