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X2816BEMB — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

X2816BEMB: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, body_height: 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN, body_length: 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM IN, features_provided: BURN IN AND ELECTROSTATIC SENSITIVE AND ERASABLE AND PROGRAMMABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-338-8481, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
X2816BEMB
NSN: 5962-01-338-8481
FSC: 5962 — Microcircuits, Electronic
CAGE: 60395 — XICOR INC (USA)
SPECIFICATIONS
body_width0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
body_height0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN
body_length0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM IN
features_providedBURN IN AND ELECTROSTATIC SENSITIVE AND ERASABLE AND PROGRAMMABLE
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern20 INPUT
inclosure_configurationLEADLESS FLAT PACK
terminal_surface_treatmentSOLDER
NSN5962-01-338-8481
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN X2816BEMB MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 20 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN
•
FEATURES PROVIDED: BURN IN AND ELECTROSTATIC SENSITIVE AND ERASABLE AND PROGRAMMABLE
•
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
•
MEMORY DEVICE TYPE: ROM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN20 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
BODY HEIGHT0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN
FEATURES PROVIDEDBURN IN AND ELECTROSTATIC SENSITIVE AND ERASABLE AND PROGRAMMABLE
INCLOSURE CONFIGURATIONLEADLESS FLAT PACK
MEMORY DEVICE TYPEROM
CASE OUTLINE SOURCE AND DESIGNATORC-12 MIL-M-38510
BODY LENGTH0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM IN
OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909
SUBSTITUTES & CROSS-REFERENCES 1
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is X2816BEMB?
X2816BEMB is a MICROCIRCUIT,MEMORY.
What parts can replace X2816BEMB?
There is 1 known substitute for X2816BEMB: ROM/PROM. Substitute compatibility should be verified for your specific system.
What is the NSN for X2816BEMB?
X2816BEMB is cataloged in the U.S. Government catalog under NSN 5962-01-338-8481. This indicates validated use in U.S. government and defense supply chains.
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