X24C16SI — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

X24C16SI: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.150 INCHES MINIMUM AND 0.158 INCHES MAXIMUM IN, body_height: 0.043 INCHES MINIMUM AND 0.065 INCHES MAXIMUM IN, body_length: 0.336 INCHES MINIMUM AND 0.345 INCHES MAXIMUM IN, features_provided: W/CLOCK AND LOW POWER AND BIDIRECTIONAL AND HIGH RELIABILITY AND MONOLITHIC, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: PLASTIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-373-5192, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

X24C16SI

NSN: 5962-01-373-5192
FSC: 5962 — Microcircuits, Electronic
CAGE: 60395 — XICOR INC (USA)

SPECIFICATIONS

body_width	0.150 INCHES MINIMUM AND 0.158 INCHES MAXIMUM IN
body_height	0.043 INCHES MINIMUM AND 0.065 INCHES MAXIMUM IN
body_length	0.336 INCHES MINIMUM AND 0.345 INCHES MAXIMUM IN
features_provided	W/CLOCK AND LOW POWER AND BIDIRECTIONAL AND HIGH RELIABILITY AND MONOLITHIC
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	PLASTIC
memory_device_type	EEPROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-40.0 TO 85.0 CELSIUS DEGC
input_circuit_pattern	5 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-373-5192

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 5 INPUT

•

INCLOSURE MATERIAL: PLASTIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.150 INCHES MINIMUM AND 0.158 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.043 INCHES MINIMUM AND 0.065 INCHES MAXIMUM IN

•

FEATURES PROVIDED: W/CLOCK AND LOW POWER AND BIDIRECTIONAL AND HIGH RELIABILITY AND MONOLITHIC

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: EEPROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	5 INPUT
INCLOSURE MATERIAL	PLASTIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.150 INCHES MINIMUM AND 0.158 INCHES MAXIMUM IN
BODY HEIGHT	0.043 INCHES MINIMUM AND 0.065 INCHES MAXIMUM IN
FEATURES PROVIDED	W/CLOCK AND LOW POWER AND BIDIRECTIONAL AND HIGH RELIABILITY AND MONOLITHIC
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	EEPROM
BODY LENGTH	0.336 INCHES MINIMUM AND 0.345 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 1

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is X24C16SI?

X24C16SI is a MICROCIRCUIT,MEMORY.

What parts can replace X24C16SI?

There is 1 known substitute for X24C16SI: ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for X24C16SI?

X24C16SI is cataloged in the U.S. Government catalog under NSN 5962-01-373-5192. This indicates validated use in U.S. government and defense supply chains.

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