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X2210DI — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

X2210DI: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include bit_quantity: 256, word_quantity: 64, features_provided: HIGH RELIABILITY, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, memory_device_type: RAM, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-413-3950, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
X2210DI
NSN: 5962-01-413-3950
FSC: 5962 — Microcircuits, Electronic
CAGE: 60395 — XICOR INC (USA)
SPECIFICATIONS
bit_quantity256
word_quantity64
features_providedHIGH RELIABILITY
output_logic_formN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
memory_device_typeRAM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-40.0 TO 85.0 CELSIUS DEGC
inclosure_configurationDUAL-IN-LINE
time_rating_per_chacteristic300.00 NANOSECONDS MAXIMUM ACCESS NS
voltage_rating_and_type_per_characteristic5.0 VOLTS NOMINAL TOTAL SUPPLY
NSN5962-01-413-3950
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN X2210DI MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
BIT QUANTITY: 256
•
WORD QUANTITY: 64
•
FEATURES PROVIDED: HIGH RELIABILITY
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: RAM
•
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
•
OUTPUT LOGIC FORM: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.0 VOLTS NOMINAL TOTAL SUPPLY
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
BIT QUANTITY256
WORD QUANTITY64
FEATURES PROVIDEDHIGH RELIABILITY
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPERAM
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
OUTPUT LOGIC FORMN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC5.0 VOLTS NOMINAL TOTAL SUPPLY
OPERATING TEMP RANGE-40.0 TO 85.0 CELSIUS DEGC
TERMINAL TYPE AND QUANTITY18 PRINTED CIRCUIT
OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909
SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE
NSN statusActive· U.S. Government catalog
No demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is X2210DI?
X2210DI is a MICROCIRCUIT,MEMORY.
What is the NSN for X2210DI?
X2210DI is cataloged in the U.S. Government catalog under NSN 5962-01-413-3950. This indicates validated use in U.S. government and defense supply chains.
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