X2210-30DMB — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

X2210-30DMB: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.265 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN, body_length: 0.880 INCHES MINIMUM AND 0.920 INCHES MAXIMUM IN, features_provided: PROGRAMMABLE AND ERASABLE AND W/ENABLE AND STATIC OPERATION, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-221-8596, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

X2210-30DMB

NSN: 5962-01-221-8596
FSC: 5962 — Microcircuits, Electronic
CAGE: 60395 — XICOR INC (USA)

SPECIFICATIONS

body_width	0.265 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.140 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN
body_length	0.880 INCHES MINIMUM AND 0.920 INCHES MAXIMUM IN
features_provided	PROGRAMMABLE AND ERASABLE AND W/ENABLE AND STATIC OPERATION
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-221-8596

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.265 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN

•

FEATURES PROVIDED: PROGRAMMABLE AND ERASABLE AND W/ENABLE AND STATIC OPERATION

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: RAM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.265 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.140 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN
FEATURES PROVIDED	PROGRAMMABLE AND ERASABLE AND W/ENABLE AND STATIC OPERATION
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	RAM
BODY LENGTH	0.880 INCHES MINIMUM AND 0.920 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 1

A574T362-101Reference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is X2210-30DMB?

X2210-30DMB is a MICROCIRCUIT,MEMORY.

What parts can replace X2210-30DMB?

There is 1 known substitute for X2210-30DMB: A574T362-101. Substitute compatibility should be verified for your specific system.

What is the NSN for X2210-30DMB?

X2210-30DMB is cataloged in the U.S. Government catalog under NSN 5962-01-221-8596. This indicates validated use in U.S. government and defense supply chains.

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