X2004EM-25/C6317: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.458 INCHES MAXIMUM IN, body_height: 0.085 INCHES MAXIMUM IN, body_length: 0.560 INCHES MAXIMUM IN, features_provided: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND BIDIRECTIONAL, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-274-7927, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.458 INCHES MAXIMUM IN |
| body_height | 0.085 INCHES MAXIMUM IN |
| body_length | 0.560 INCHES MAXIMUM IN |
| features_provided | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND BIDIRECTIONAL |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | RAM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 21 INPUT |
| inclosure_configuration | LEADLESS FLAT PACK |
| NSN | 5962-01-274-7927 |
| INPUT CIRCUIT PATTERN | 21 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.458 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.085 INCHES MAXIMUM IN |
| FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND BIDIRECTIONAL |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| MEMORY DEVICE TYPE | RAM |
| BODY LENGTH | 0.560 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |