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VC120630D650 — SEMICONDUCTOR DEVICE,DIODE

✓ Government record, cited
— · SFP TRANSCEIVER
PRODUCT OVERVIEW

VC120630D650: SEMICONDUCTOR DEVICE,DIODE.

The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: CERAMIC ENCLOSURE, overall_width: 0.063 INCHES NOMINAL IN, overall_height: 0.040 INCHES NOMINAL IN, overall_length: 0.126 INCHES NOMINAL IN, mounting_method: PRESS FIT, terminal_type_and_quantity: 1 BONDING PAD. This part is cataloged in the U.S.

Government catalog under NSN 5961-01-463-8082, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
VC120630D650
NSN: 5961-01-463-8082
FSC: 5961 — Semiconductor Devices and Associated Hardware
CAGE: 04222 — KYOCERA AVX COMPONENTS CORPORATION (USA)
SPECIFICATIONS
materialCERAMIC ENCLOSURE
overall_width0.063 INCHES NOMINAL IN
overall_height0.040 INCHES NOMINAL IN
overall_length0.126 INCHES NOMINAL IN
mounting_methodPRESS FIT
terminal_type_and_quantity1 BONDING PAD
voltage_rating_in_volts_per_characteristic30.0 NOMINAL BREAKOVER VOLTAGE, DC
NSN5961-01-463-8082
COMPONENT DIAGRAM
BAIL LATCH 10G SFP+ 850nm · SR (MMF, 300m) DOM: Digital Optical Monitoring TX RX LC DUPLEX 20-PIN EDGE CONNECTOR ~56.5 mm ~13.4mm SFP+ TRANSCEIVER | 10G | 850nm | SR (MMF, 300m) Hot-swappable | LC duplex fiber | DDM/DOM supported TITLE SFP+ XCVR PN VC120630D650 MFR OEM SEMICONDUCTOR DEVICE,DIODE
KEY FEATURES
•
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC: 30.0 NOMINAL BREAKOVER VOLTAGE, DC
•
MOUNTING METHOD: PRESS FIT
•
MATERIAL: CERAMIC ENCLOSURE
•
TERMINAL TYPE AND QUANTITY: 1 BONDING PAD
TECHNICAL CHARACTERISTICS
OVERALL HEIGHT0.040 INCHES NOMINAL IN
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC30.0 NOMINAL BREAKOVER VOLTAGE, DC
MOUNTING METHODPRESS FIT
OVERALL LENGTH0.126 INCHES NOMINAL IN
OVERALL WIDTH0.063 INCHES NOMINAL IN
MATERIALCERAMIC ENCLOSURE
MATERIALZINC SULFIDE SEMICONDUCTOR
TERMINAL TYPE AND QUANTITY1 BONDING PAD
OTHER ITEMS IN FSC 5961 — Semiconductor Devices and Associated Hardware
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5961-00-000-0150 5961-00-000-4541 5961-00-000-5400 5961-00-000-7614 5961-00-000-8760 5961-00-001-1352 5961-00-001-2624 5961-00-001-2978
SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Normally procured from the manufacturer (OEM)No demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is VC120630D650?
VC120630D650 is a SEMICONDUCTOR DEVICE,DIODE.
What is the NSN for VC120630D650?
VC120630D650 is cataloged in the U.S. Government catalog under NSN 5961-01-463-8082. This indicates validated use in U.S. government and defense supply chains.
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✓ PartsTable — the parts reference. Every fact cited to its source.
PartsTable Design LLC · partstable.com
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-18.
PartsTable commercial catalog: edition Unified commercial catalog snapshot through 2026-09-28, edition date not on file, retrieved 2026-09-28.