V156: SEALING COMPOUND.
The SEALING COMPOUND is a the manufacturer industrial component. Key specifications include curing_method: AIR DRIED, physical_form: LIQUID, part_name_assigned_by_controlling_agency: MOISTURE TOLERANT QUICK SET EPOXY SEALER. This part is cataloged in the U.S.
Government catalog under NSN 8030-01-682-2094, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| curing_method | AIR DRIED |
| physical_form | LIQUID |
| part_name_assigned_by_controlling_agency | MOISTURE TOLERANT QUICK SET EPOXY SEALER |
| NSN | 8030-01-682-2094 |
| CURING METHOD | AIR DRIED |
| PHYSICAL FORM | LIQUID |
| COLOR | CLEAR |
| SPECIAL FEATURES | 2 PART COMPONENT; PART A: CLEAR RESIN; LIQUID; SOLVENT ODOR; DENSITY: 8.4-8.5; SPECIFIC GRAVITY: 1.00-1.02; WEIGHT PERCENT: 10.00-20.00%; VOLATILITY PERCENT: 10.00-20.00; WEIGHT PERCENT VOLATILE: 80.00-90.00; VOLATILITY PERCENT VOLUME: 80.00-90.00; VOC: 100.00; BOILING POINT: 212.00 DEG. F.; FLASH POINT: 212.00 DEG. F. PM CC; PART B: LIQUID; SOLVENT ODOR; DENSITY: 9.1-9.2; SPECIFIC GRAVITY: 1.09-1.11; WEIGHT PERCENT SOLID: 90.00-100.00%; VOLATILE PERCENT SOLID: 90.00-100.00; WEIGHT PERCENT VOLUME: 0.0-10.00%; VOLATILE PERCENT VOLUME: 0.0-10.00%; VOC: <100.00; BOILING POINT: 392.00 DEG. F.; FLASH POINT: 302.00 DEG. F. PM CC; INCOMPATIBLE MATERIALS: ACIDS, BASES AND OXIDIZING AGENTS; HAZARDOUS DECOMPOSITION PRODUCTS: IRRITATING GASES AND VAPORS; AVOID FREEZING, OPEN FLAME, HOT SURFACES, STATIC ELECTRICITY AND SOURCES OF IGNITION; |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | MOISTURE TOLERANT QUICK SET EPOXY SEALER |