UXA2S220 — SEMICONDUCTOR DEVICE,DIODE

✓ Government record, cited

— · SFP TRANSCEIVER

PRODUCT OVERVIEW

UXA2S220: SEMICONDUCTOR DEVICE,DIODE.

The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.050 INCHES MAXIMUM IN, mounting_method: PRESS FIT, overall_diameter: 0.055 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED CASE, terminal_type_and_quantity: 2 BONDING PAD. This part is cataloged in the U.S.

Government catalog under NSN 5961-01-165-5170, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

UXA2S220

NSN: 5961-01-165-5170
FSC: 5961 — Semiconductor Devices and Associated Hardware
CAGE: 3BBY6 — SEMI-GENERAL, INC. DBA SEMIGEN (USA)

SPECIFICATIONS

material	SILICON SEMICONDUCTOR
overall_length	0.050 INCHES MAXIMUM IN
mounting_method	PRESS FIT
overall_diameter	0.055 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED CASE
terminal_type_and_quantity	2 BONDING PAD
power_rating_per_characteristic	100.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION
capacitance_rating_in_picofarads	0.08 NOMINAL
voltage_rating_in_volts_per_characteristic	3.0 MINIMUM BREAKDOWN VOLTAGE, DC
maximum_operating_temp_per_measurement_point	150.0 CELSIUS AMBIENT AIR DEGC
NSN	5961-01-165-5170

COMPONENT DIAGRAM

KEY FEATURES

•

VOLTAGE RATING IN VOLTS PER CHARACTERISTIC: 3.0 MINIMUM BREAKDOWN VOLTAGE, DC

•

MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 150.0 CELSIUS AMBIENT AIR DEGC

•

OVERALL DIAMETER: 0.055 INCHES MAXIMUM IN

•

MOUNTING METHOD: PRESS FIT

•

FEATURES PROVIDED: HERMETICALLY SEALED CASE

•

CAPACITANCE RATING IN PICOFARADS: 0.08 NOMINAL

•

MATERIAL: SILICON SEMICONDUCTOR

TECHNICAL CHARACTERISTICS

VOLTAGE RATING IN VOLTS PER CHARACTERISTIC	3.0 MINIMUM BREAKDOWN VOLTAGE, DC
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT	150.0 CELSIUS AMBIENT AIR DEGC
OVERALL DIAMETER	0.055 INCHES MAXIMUM IN
MOUNTING METHOD	PRESS FIT
OVERALL LENGTH	0.050 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED CASE
CAPACITANCE RATING IN PICOFARADS	0.08 NOMINAL
MATERIAL	SILICON SEMICONDUCTOR
TERMINAL TYPE AND QUANTITY	2 BONDING PAD
POWER RATING PER CHARACTERISTIC	100.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION

OTHER ITEMS IN FSC 5961 — Semiconductor Devices and Associated Hardware

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5961-00-000-0150 5961-00-000-4541 5961-00-000-5400 5961-00-000-7614 5961-00-000-8760 5961-00-001-1352 5961-00-001-2624 5961-00-001-2978

SUBSTITUTES & CROSS-REFERENCES 1

A2S220Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Normally procured from the manufacturer (OEM)No demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is UXA2S220?

UXA2S220 is a SEMICONDUCTOR DEVICE,DIODE.

What parts can replace UXA2S220?

There is 1 known substitute for UXA2S220: A2S220. Substitute compatibility should be verified for your specific system.

What is the NSN for UXA2S220?

UXA2S220 is cataloged in the U.S. Government catalog under NSN 5961-01-165-5170. This indicates validated use in U.S. government and defense supply chains.

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UXA2S220 — SEMICONDUCTOR DEVICE,DIODE

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