The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.710 INCHES MAXIMUM IN, mounting_method: THREADED STUD(S), overall_diameter: 0.145 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED CASE, nominal_thread_size: 0.190 INCHES IN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-411-7542, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_length | 0.710 INCHES MAXIMUM IN |
| mounting_method | THREADED STUD(S) |
| overall_diameter | 0.145 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED CASE |
| nominal_thread_size | 0.190 INCHES IN |
| thread_series_designator | UNF |
| mounting_facility_quantity | 1 |
| overall_width_across_flats | 0.187 INCHES NOMINAL IN |
| terminal_type_and_quantity | 1 SOLDER STUD AND 1 THREADED STUD |
| current_rating_per_characteristic | 9.00 AMPERES MAXIMUM AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE |
| voltage_rating_in_volts_per_characteristic | 100.0 MAXIMUM REVERSE VOLTAGE, PEAK |
| NSN | 5961-00-411-7542 |
| OVERALL LENGTH | 0.300 INCHES NOMINAL IN |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| MOUNTING METHOD | TERMINAL |
| OVERALL DIAMETER | 0.145 INCHES NOMINAL IN |
| MATERIAL | SILICON SEMICONDUCTOR |
| MATERIAL | GLASS ENCLOSURE |
| TERMINAL TYPE AND QUANTITY | 2 PIN |