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UPD416C-2 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

UPD416C-2: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.290 INCHES MAXIMUM IN, body_height: 0.180 INCHES MAXIMUM IN, body_length: 0.810 INCHES MAXIMUM IN, bit_quantity: 16384, word_quantity: 16384, features_provided: W/STROBE AND W/ENABLE AND DYNAMIC AND HIGH PERFORMANCE. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-130-3729, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
UPD416C-2
NSN: 5962-01-130-3729
FSC: 5962 — Microcircuits, Electronic
CAGE: 51984 — NEC AMERICA INC (USA)
SPECIFICATIONS
body_width0.290 INCHES MAXIMUM IN
body_height0.180 INCHES MAXIMUM IN
body_length0.810 INCHES MAXIMUM IN
bit_quantity16384
word_quantity16384
features_providedW/STROBE AND W/ENABLE AND DYNAMIC AND HIGH PERFORMANCE
output_logic_formN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeRAM
storage_temp_range-55.0 TO 150.0 CELSIUS DEGC
operating_temp_range+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern11 INPUT
NSN5962-01-130-3729
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN UPD416C-2 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
BIT QUANTITY: 16384
•
INPUT CIRCUIT PATTERN: 11 INPUT
•
WORD QUANTITY: 16384
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.290 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.180 INCHES MAXIMUM IN
•
FEATURES PROVIDED: W/STROBE AND W/ENABLE AND DYNAMIC AND HIGH PERFORMANCE
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
BIT QUANTITY16384
INPUT CIRCUIT PATTERN11 INPUT
WORD QUANTITY16384
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.290 INCHES MAXIMUM IN
BODY HEIGHT0.180 INCHES MAXIMUM IN
FEATURES PROVIDEDW/STROBE AND W/ENABLE AND DYNAMIC AND HIGH PERFORMANCE
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPERAM
OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909
SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE
NSN statusActive· U.S. Government catalog
Demilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is UPD416C-2?
UPD416C-2 is a MICROCIRCUIT,MEMORY.
What is the NSN for UPD416C-2?
UPD416C-2 is cataloged in the U.S. Government catalog under NSN 5962-01-130-3729. This indicates validated use in U.S. government and defense supply chains.
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✓ PartsTable — the parts reference. Every fact cited to its source.
PartsTable Design LLC · partstable.com
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-18.
PartsTable commercial catalog: edition Unified commercial catalog snapshot through 2026-09-28, edition date not on file, retrieved 2026-09-28.